Any questions? Or would you like to order a product from our partner? Contact us directly.
Any questions? Or would you like to order a product from our partner? Contact us directly.
3D PLUS is the world-leading supplier of advanced high-density 3D electronic products, bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. Its patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and enables stacking heterogeneous active, passive and Opto-electronics.
Any questions? Or would you like to order a product from our partner? Contact us directly.
PEO refers you to our partner's product overview.
Here you will find up-to-date information on all products and services.
In collaboration with the French Atomic Energy Commission (CEA), the Spectro Imager Spid-X has been designed for nuclear safety applications such as radioactive waste monitoring, decommissioning, decontamination or emergency situations. The device offers fine spectroscopic capabilities embedding ultra-low noise ASICs and... Read more
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